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平头哥-芯片互联设计专家-上海

发布时间: 2020-09-15 工作地点: 上海 工作年限: 五年以上
所属部门: 阿里集团 学   历: 本科 招聘人数: 若干

团队介绍:

你有机会和一流的芯片团队一起搭建高端芯片设计平台,参与新一代计算芯片的开发。作为芯片架构师,你将推动下一代芯片的架构和微架构的设计,以满足业务需求.

岗位描述:

Candidate will be responsible for
1. Plan design projects and help address the unique needs of our customers.
2. Review vendor capability to support development.
3. Participates in the development of Architecture and Microarchitecture specifications for the Logic components.
4. Provides IP integration support to SoC customers and represents RTL team.
5. Define micro-architecture of logic blocks while making power/performance/area (PPA) trade-offs and write detailed specifications.
6. Collaborate with design verification team to develop a detailed verification test-plan and support simulation bring-up/debug and bug fixes.
7. Use of various design tools (Linting, CDC, LEC, Fishtail, CLP etc.) to check and improve design quality Implementation of Low power logic, targeting power, performance, area, and timing goals.

岗位要求:

芯片互联设计师需相关研究所专业,加上至少5年以上ASIC/FPGA经验。并满足以下一个或多个方向
5+ years ASIC/FPGA Digital design, verification, or related work experience.

1. Excellent problem solving skills and attention to detail
2. Great communication skills with ability to work independently or as part of a team
3. Experience with implementing high-speed data communication system.
4. ASIC design and verification experiences including architecture,
5. Experience with synthesis, and timing closure.
6. Experience with scripting tools (Perl/Python)
7. Experience with DC, LINT, LEC, and CDC.
8. Experience working in a multi-disciplinary, global team focused on advanced, high volume applications. Being familar with AXI/AHB/ACE bus protocols and SoC integration experiences.
9. Expreience with CCIX, CXL, QPI/UPI, and GenZ is plus.
10. Knowledge of cache coherence operations is big plus.
11. Ability to quickly react and adapt to changes.

 

 

申请此职位表明您已阅读并同意阿里巴巴及关联公司的《申请工作机会须知》。

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